7. Japanese Chip Ceramic Capacitor Murata distributor-Circuit Ocean.
4. Flux for Flow Soldering 1. An excessive amount of flux generates a large quantity of flux gas, which can cause a deterioration of solderability, so apply flux thinly and evenly throughout. (A foaming system is generally used for flow soldering.) 2. Flux containing too high a percentage of halide may cause corrosion of the terminations unless there is sufficient cleaning. Use flux with a halide content of 0.1% max. 3. Do not use strong acidic flux.
o Set temperature and time to ensure that leaching of the terminations does not exceed 25% of the chip end area as a single chip (full length of the edge A-B-C-D shown at right) and 25% of the length A-B shown as mounted on substrate. [As a Single Chip] [As Mounted on Substrate] 5
6. Reflow Soldering
The halogen system substance and organic acid are included in solder paste, and a chip corrodes by this kind of solder paste
1. Please evaluate the capacitor using actual cleaning equipment and conditions to confirm the quality, and select the solvent for cleaning. 2. Unsuitable cleaning solvent may leave residual flux or other foreign substances, causing deterioration of electrical characteristics and the reliability of the capacitors
1. A crack may be caused in the capacitor due to the stress of the thermal contraction of the resin during curing process. The stress is affected by the amount of resin and curing contraction. Select a resin with low curing contraction. The difference in the thermal expansion coefficient between a coating resin or a molding resin and the capacitor may cause the destruction and deterioration of the capacitor such as a crack or peeling, and lead to the deterioration of insulation resistance or dielectric breakdown. Select a resin for which the thermal expansion coefficient is as close to that of the capacitor as possible. A silicone resin can be used as an under-coating to buffer against the stress